Semiconductor packaging materials market seen reaching $86.15 billion by 2030

The semiconductor and IC packaging materials market rose to $56.2 billion in 2026 from $50.32 billion in 2025, driven by consumer electronics demand, semiconductor manufacturing growth and advanced chip packaging needs. The Business Research Company projects the market will reach $86.15 billion by 2030, with Asia-Pacific leading and North America growing fastest.

Why it matters: - Semiconductor and IC packaging materials help protect chips, provide electrical connectivity and manage heat after fabrication. - The market is expanding as semiconductor devices become smaller, more powerful and more widely used across consumer electronics, electric vehicles and high-performance computing. - Growth in packaging materials signals broader demand for advanced electronics manufacturing capacity.

What happened: - The semiconductor and integrated circuit packaging materials market increased from $50.32 billion in 2025 to $56.2 billion in 2026. - That growth equals a 11.7% compound annual growth rate. - The Business Research Company projects the market will reach $86.15 billion by 2030, at an 11.3% CAGR. - The report was published Oct. 1, 2026. - More information

The details: - Consumer electronics demand is a major driver, including smartphones, laptops, tablets, smart TVs, wearables and smart home devices. - Semiconductor packaging materials support device protection, electrical connections, heat dissipation and miniaturization. - Japan’s consumer electronic equipment production reached $209.16 million in May 2023, up from $164.65 million in May 2022, according to the Japan Electronics and Information Technology Industries Association. - Rising semiconductor fabrication capacity and demand for efficient thermal management materials are adding to market growth. - The report highlights trends in advanced packaging materials, high-performance IC packaging, miniaturized and thermally optimized materials, and substrate and die attach technologies.

Between the lines: - The market’s momentum reflects a shift in electronics from basic chip protection toward packaging as a performance-critical part of the semiconductor stack. - Asia-Pacific’s lead points to the region’s concentration of chip manufacturing and electronics assembly. - North America’s faster expected growth suggests more investment in advanced packaging and next-generation semiconductor technologies. - The report also notes expanded 2026 market features, including market attractiveness scoring, TAM analysis, company scoring matrices, Excel dashboards and market hotspot infographics.

What's next: - The market is expected to keep growing as advanced packaging gains importance in AI, high-performance computing and connected vehicles. - Semiconductor makers will likely keep pushing for materials that improve thermal control, reliability and chip density. - The report expects continued regional competition, with Asia-Pacific remaining dominant and North America accelerating more quickly.

The bottom line: - Semiconductor packaging materials are moving from a support category to a strategic growth market tied directly to chip performance, manufacturing scale and electronics demand.